Samsung Electronics Co., Ltd.

Seungjin Cheon

Tea-Geon Kim

Ohchul Kwon

Bubryong Lee

Junglae Jung

Junho Cho

Heungkyu Kwon

A method of manufacturing a package-on-package device includes a bonding step carried out by a bonding apparatus including a pressing member and a light source that produces a laser beam. A bottom package including a lower substrate, lower solder balls alongside an edge of the lower substrate, and a lower chip on a center of the lower substrate is provided, the bottom package is bonded to an interposer substrate having upper solder balls aligned with the lower solder balls, and a top package having an upper substrate and an upper chip on the upper substrate is bonded to the interposer substrate. While the interposer substrate is disposed on the bottom package, the pressing member presses the interposer substrate against the bottom package, and the laser beam adheres the lower solder balls to the upper solder balls.

Method of manufacturing package-on-package device and bonding apparatus used therein

The inventive concepts provide an apparatus for manufacturing a semiconductor package and a method for manufacturing a semiconductor package using the same. The apparatus includes a mold unit with a cavity formed by an inner space of the mold unit. The mold unit includes a first mold, a second mold coupled to the first mold, a supply part supplying a molding resin into the cavity, and a vent part disposed to be opposite to the supply part. The vent part includes a first vent part fixed in the mold unit, and a second vent part movable with respect to the first vent part.

Apparatus for manufacturing semiconductor package and method for manufacturing semiconductor package using the same

Semiconductor packages are disclosed. In a semiconductor package, a package board may include a hole. A mold layer may cover an upper portion of the package board and extend through the hole to cover at least a portion of a bottom surface of the package board. Each of the sidewalls of a lower mold portion may have a symmetrical structure with respect to the hole penetrating the package board, such that a warpage phenomenon of the semiconductor package may be reduced.

Growing community of inventors

Chungcheongnam-do, South Korea

Seungjin Cheon