The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2015
Filed:
Jul. 25, 2013
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Heungkyu Kwon, Hwasung, KR;
Seungjin Cheon, Hwasung, KR;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/13 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/28 (2006.01); H01L 25/065 (2006.01); H01L 25/10 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/49816 (2013.01); H01L 23/28 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/18301 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 21/565 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1076 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/15151 (2013.01);
Abstract
Semiconductor packages are disclosed. In a semiconductor package, a package board may include a hole. A mold layer may cover an upper portion of the package board and extend through the hole to cover at least a portion of a bottom surface of the package board. Each of the sidewalls of a lower mold portion may have a symmetrical structure with respect to the hole penetrating the package board, such that a warpage phenomenon of the semiconductor package may be reduced.