This inventor holds 2 USPTO granted patents. Top assignees: Lx Semicon Co., Ltd., Lx Semicon Co., Ltd.. Active years: 2024-2026.
Company Filing History:
Years Active: 2024-2026
Title: Seung Hoon Jin: Innovator in Chip Packaging Technology
Introduction
Seung Hoon Jin is a notable inventor based in Daejeon, South Korea. He has made significant contributions to the field of chip packaging technology, particularly through his innovative designs and patents. His work has implications for the efficiency and functionality of electronic devices.
Latest Patents
One of Seung Hoon Jin's key patents is titled "Test pad and chip on film package including the same." This patent describes a chip on film (COF) package that incorporates a predetermined driving integrated circuit (IC). The design features a wiring structure connected to the driving IC and a test pad linked to this wiring structure. Notably, the test pad consists of a base film divided into a first region and a second region, with a conductive layer located in the first region. The second region is surrounded by the first region in a plan view. This innovative design enhances the functionality of chip packaging.
Career Highlights
Seung Hoon Jin is currently employed at Lx Semicon Co., Ltd., where he continues to develop cutting-edge technologies in the semiconductor industry. His expertise in chip packaging has positioned him as a valuable asset to his company and the broader field of electronics.
Collaborations
Seung Hoon Jin collaborates with various professionals in his field, including his coworker Young Min Choi. Their combined efforts contribute to advancements in semiconductor technology and innovation.
Conclusion
Seung Hoon Jin's contributions to chip packaging technology through his patent and work at Lx Semicon Co., Ltd. highlight his role as an influential inventor in the electronics industry. His innovative designs continue to shape the future of semiconductor applications.