The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2024
Filed:
Jul. 06, 2022
Applicant:
Lx Semicon Co., Ltd., Daejeon, KR;
Inventors:
Seung Hoon Jin, Daejeon, KR;
Young Min Choi, Daejeon, KR;
Assignee:
LX SEMICON CO., LTD., Daejeon, KR;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G09G 3/00 (2006.01); G01R 3/00 (2006.01); G01R 31/27 (2006.01);
U.S. Cl.
CPC ...
G09G 3/006 (2013.01); G09G 2300/0408 (2013.01); G09G 2300/0426 (2013.01); G09G 2330/12 (2013.01);
Abstract
A chip on film (COF) package in which a predetermined driving integrated circuit (IC) is mounted includes a wiring structure connected to the driving IC, and a test pad connected to the wiring structure, wherein the test pad includes a base film divided into a first region and a second region, and a conductive layer located in the first region, and the second region is surrounded by the first region in a plan view.