The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Jan. 31, 2024
Lx Semicon Co., Ltd., Daejeon, KR;
Seung Hoon Jin, Daejeon, KR;
Min Ho Jeon, Daejeon, KR;
LX SEMICON CO., LTD., Daejeon, KR;
Abstract
Disclosed is a chip-on-film package capable of preventing damage to a surface thereof. The chip-on-film package includes a flexible base film, a first metal wiring layer formed on a first surface of the base film, a first surface insulating layer formed on the first metal wiring layer, a semiconductor chip connected to the first metal wiring layer through an opening formed in the first surface insulating layer, and a spacer formed on the first surface insulating layer within a target area, which is an area within which the first surface insulating layer and a structure of a display panel contact each other. At least one groove is formed in the first surface insulating layer within the target area, and the spacer includes a first spacer filled in the groove.