IDiyas

For the Inventor, By the Inventor

Beaverton, OR, United States of America

Seri Lee

USPTO Granted Patents = 12 

Average Co-Inventor Count = 1.7

ph-index = 8

Forward Citations = 172(Granted Patents)


Company Filing History:

goldMedal12 out of 54,664 
 
Intel Corporation
 patents

Years Active: 2002-2009

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12 patents (USPTO):Explore Patents
1. 7535708 - Fan integrated thermal management device (2009-05-19),
2. 7499274 - Method, apparatus and system for enclosure enhancement (2009-03-03),
3. 7495922 - Spring loaded heat sink retention mechanism (2009-02-24),
4. 7321184 - Rake shaped fan (2008-01-22),
5. 7019977 - Method of attaching non-adhesive thermal interface materials (2006-03-28),
6. 6870736 - Heat sink and package surface design (2005-03-22),
7. 6845010 - High performance heat sink configurations for use in high density packaging applications (2005-01-18),
8. 6757170 - Heat sink and package surface design (2004-06-29),
9. 6633484 - Heat-dissipating devices, systems, and methods with small footprint (2003-10-14),
10. 6535385 - High performance heat sink configurations for use in high density packaging applications (2003-03-18),
11. 6501655 - High performance fin configuration for air cooled heat sinks (2002-12-31),
12. 6479895 - High performance air cooled heat sinks used in high density packaging applications (2002-11-12),

Title: Innovator Spotlight: Seri Lee

Introduction

Seri Lee is a prominent inventor based in Beaverton, OR (US). She has made significant contributions to the field of thermal management devices, holding a total of 12 patents. Her work is characterized by innovative solutions that enhance the efficiency and functionality of various devices.

Latest Patents

One of her latest patents is a fan integrated thermal management device. This device includes a heat-conductive base and a plurality of heat-conductive extensions that define fan blade regions. The integrated fan facilitates airflow through the device, improving thermal management. Another notable patent is a method, apparatus, and system for enclosure enhancement. This invention focuses on enhancing the enclosure of computing devices, utilizing materials with different thermal properties and incorporating vents or openings for improved performance.

Career Highlights

Seri Lee is currently employed at Intel Corporation, where she continues to innovate and develop new technologies. Her work has been instrumental in advancing thermal management solutions in the tech industry.

Collaborations

Throughout her career, Seri has collaborated with notable colleagues, including Lloyd L Pollard, II and Phillip H Chen. These collaborations have further enriched her contributions to the field.

Conclusion

Seri Lee's innovative spirit and dedication to her work have established her as a leading inventor in thermal management technology. Her patents reflect her commitment to enhancing device performance and efficiency.

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