The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2002
Filed:
Nov. 20, 2000
Seri Lee, Beaverton, OR (US);
Lloyd L. Pollard, II, Portland, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A heat dissipation system and method for extracting heat from an integrated circuit device includes, in one example embodiment, a thermally conductive base plate. The heat dissipation system and method further includes an array of substantially parallel fin structures having top and bottom portions. The thermally conductive base plate is attached to the array such that the thermally conductive base plate is in close proximity to the bottom portion. The top and bottom portions extend outwardly from the thermally conductive base plate. The top portion of the array further extends laterally beyond the bottom portion of the array. The top and bottom portions of the array are of sufficient size so as to allow components on a motherboard to encroach around the integrated circuit device.