Company Filing History:
Years Active: 2005-2008
Title: Innovations by Serafin Pedron
Introduction
Serafin Pedron is an accomplished inventor based in Manteca, California. He has made significant contributions to the field of integrated circuit packaging, holding a total of 2 patents. His work focuses on innovative processes that enhance the efficiency and functionality of semiconductor devices.
Latest Patents
Serafin's latest patents include a "Thin array plastic package without die attach pad and process for fabricating the same." This invention outlines a method for creating an integrated circuit package where metal is plated onto a substrate to form contact pads and fiducial markings. A transparent mask is selectively applied, allowing for precise mounting and encapsulation of the semiconductor die. The process culminates in singulating the integrated circuit package using fiducial markings.
Another notable patent is the "Integrated circuit package and method of manufacturing the integrated circuit package." This invention describes an integrated circuit package featuring a lead frame with an inner and outer pad connected by a channel. The semiconductor die is electrically coupled to the inner pad, and the encapsulant material covers part of the lead frame while exposing a portion of the outer pad. This innovative design improves the overall performance and reliability of the integrated circuit package.
Career Highlights
Serafin Pedron is currently employed at A-Sat Corporation, where he continues to develop cutting-edge technologies in semiconductor packaging. His expertise in the field has positioned him as a valuable asset to the company and the industry at large.
Collaborations
Throughout his career, Serafin has collaborated with notable colleagues, including Neil Robert McLellan and Lin Tsui Yee. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Serafin Pedron's contributions to the field of integrated circuit packaging demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of semiconductor technology and a drive to improve device performance.