A-sat Corporation

Serafin Pedron

Leo M Higgins, Iii

Neil McLellan

Kwok Cheung Tsang

Kin Pui Kwan

Neil Robert McLellan

Lin Tsui Yee

A process for fabricating an integrated circuit package. Metal is plated up on a substrate to provide a plurality of contact pads and a plurality of fiducial markings on a periphery of the contacts. A transparent mask is selectively deposited on the substrate, over the fiducial markings. A semiconductor die is mounted on the substrate such that the contact pads circumscribe the semiconductor die and the semiconductor die is wire bonded to ones of the contact pads. The wire bonds are encapsulated and the semiconductor die and contact pads are covered in a molding material. The substrate is selectively etched to thereby etch away the substrate underneath the contact pads and the semiconductor die. The integrated circuit package is singulated from other integrated circuit packages by sawing using the fiducial markings.

Thin array plastic package without die attach pad and process for fabricating the same

The present invention relates to an integrated circuit package and method of manufacturing an integrated circuit package. In one aspect, the present invention relates to an integrated circuit package including a lead frame having a lead with an inner pad and an outer pad connected by a connection member, wherein a region of the inner pad and a region of the outer pad are separated by a channel extending through a width of the lead. Such an integrated circuit package further includes a semiconductor die electrically coupled with the inner pad of the lead, and an encapsulant material encapsulating at least a portion of said lead frame, wherein a portion of said outer pad is exposed. In another aspect, the present invention relates to a method including providing a matrix of lead frames, each of the lead frames having a lead, forming a channel extending through a width of the lead to create an inner pad, an outer pad and a connection member in the lead, electrically coupling a semiconductor die with the inner pad, and encapsulating at least a portion of the lead frame such that at least a portion of the outer pad is exposed.

Integrated circuit package and method of manufacturing the integrated circuit package

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Manteca, CA, United States of America

Serafin Pedron