Seonju Oh

Title: Inventor Seonju Oh: Innovations in Substrate Treatment and Wafer Dividing Technologies

Introduction

Seonju Oh, a distinguished inventor based in Cheonan-si, Korea, has made significant contributions to the fields of substrate treatment and wafer processing technologies. With two patents to his name, he continues to advance innovation within his area of expertise.

Latest Patents

Seonju Oh's latest inventions include the "Substrate Treating Apparatus and Substrate Treating Method" and the "Wafer Dividing Apparatus and Methods." The substrate treating apparatus features a tape supply member designed to attach a tape to a substrate, a collection mechanism for surplus tape, a support member for substrate stability, and a temperature adjustment module for optimal tape performance. His wafer dividing apparatus comprises a chuck unit, cutting wire, and etchant supplying nozzle, all working collaboratively to enhance the efficiency of wafer cutting processes.

Career Highlights

Seonju Oh is currently employed at Samsung Electronics Co., Ltd., where he applies his expertise in innovative technology development. His role involves creating solutions that enhance manufacturing processes in the semiconductor industry.

Collaborations

Throughout his career, Seonju has collaborated with notable peers such as Geunwoo Kim and Seunghee Lee. These partnerships have played a key role in fostering innovation and driving successful project outcomes at Samsung Electronics.

Conclusion

Seonju Oh's contributions to substrate treatment and wafer dividing technology underline his role as an influential inventor in the field. His patents not only reflect his creativity but also have the potential to impact the future of semiconductor manufacturing processes significantly.