Samsung Electronics Co., Ltd.

Seonju Oh

Geunwoo Kim

Seunghee Lee

Hyun Cheol Kim

Ohchul Kwon

Sangho An

HeuiSeog Kim

Yun-Sik Yoo

Hotae Jin

An embodiment includes a substrate treating apparatus comprising: a tape supply member configured to supply a tape to be attached to a substrate; a tape collection member configured to collect a surplus tape that remains after the tape is attached to the substrate; a support member disposed between the tape supply member and the tape collection member and configured to support the substrate while the tape is attached to the substrate; and a temperature adjustment member configured to adjust a temperature of the tape that is supplied from the tape supply member to the support member.

Substrate treating apparatus and substrate treating method

Example embodiments are directed to a wafer dividing apparatus and method thereof. The wafer dividing apparatus includes a chuck unit having upper and lower chucks, a cutting wire that is provided in a space between the upper and lower chucks to cut a wafer and driven by a first driving unit, and an etchant supplying nozzle supplying etchant to a groove of the wafer, which is formed by the cutting wire.

Wafer dividing apparatus and methods

Growing community of inventors

Cheonan-si, South Korea

Seonju Oh