The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9881827 B1

Date of Patent:

Jan. 30, 2018

Filed:

May. 15, 2015

Substrate treating apparatus and substrate treating method

Applicants:

Geunwoo Kim, Asan-si, KR;

Seunghee Lee, Asan-si, KR;

Hyun Kim, Asan-si, KR;

Ohchul Kwon, Cheonan-si, KR;

Sangho an, Suwon-si, KR;

Seonju OH, Cheonan-si, KR;

Yun-sik Yoo, Seongnam-si, KR;

Inventors:

Geunwoo Kim, Asan-si, KR;

Seunghee Lee, Asan-si, KR;

Hyun Kim, Asan-si, KR;

Ohchul Kwon, Cheonan-si, KR;

Sangho An, Suwon-si, KR;

Seonju Oh, Cheonan-si, KR;

Yun-Sik Yoo, Seongnam-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., , KR;

Attorney:

Renaissance IP Law Group LLP

Primary Examiner:

Carson Gross

Int. Cl.

CPC ...

B32B 37/08 (2006.01); H01L 21/683 (2006.01); B32B 37/00 (2006.01); B32B 37/16 (2006.01); H01L 21/67 (2006.01); B32B 38/18 (2006.01); B32B 41/00 (2006.01); B32B 37/14 (2006.01); G02F 1/13 (2006.01); B32B 37/18 (2006.01); B32B 38/00 (2006.01); B32B 38/10 (2006.01);

U.S. Cl.

CPC ...

H01L 21/6836 (2013.01); B32B 37/0015 (2013.01); B32B 37/0053 (2013.01); B32B 37/16 (2013.01); H01L 21/67109 (2013.01); H01L 21/67132 (2013.01); B32B 37/08 (2013.01); B32B 37/144 (2013.01); B32B 37/18 (2013.01); B32B 38/0004 (2013.01); B32B 38/0036 (2013.01); B32B 38/10 (2013.01); B32B 38/164 (2013.01); B32B 38/18 (2013.01); B32B 38/1858 (2013.01); B32B 41/00 (2013.01); B32B 2307/202 (2013.01); B32B 2307/30 (2013.01); B32B 2309/02 (2013.01); B32B 2457/14 (2013.01); B32B 2457/20 (2013.01); B65H 2301/517 (2013.01); G02F 1/1303 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68304 (2013.01); H01L 2221/68327 (2013.01); Y10T 156/10 (2015.01); Y10T 156/17 (2015.01);

Abstract

An embodiment includes a substrate treating apparatus comprising: a tape supply member configured to supply a tape to be attached to a substrate; a tape collection member configured to collect a surplus tape that remains after the tape is attached to the substrate; a support member disposed between the tape supply member and the tape collection member and configured to support the substrate while the tape is attached to the substrate; and a temperature adjustment member configured to adjust a temperature of the tape that is supplied from the tape supply member to the support member.

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