Location History:
- Cheonan-si, KR (2018)
- Bucheon-si, KR (2020)
- Suwon-si, KR (2021)
- Chungcheongnam-do, KR (2021 - 2023)
Company Filing History:
Years Active: 2018-2023
Title: Ohchul Kwon: Innovator in Package-on-Package Technology
Introduction
Ohchul Kwon is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of electronics, particularly in the development of advanced packaging technologies. With a total of 5 patents to his name, Kwon continues to push the boundaries of innovation in the industry.
Latest Patents
Kwon's latest patents include a method of manufacturing a package-on-package device and a bonding apparatus used therein. This method involves a bonding step carried out by a bonding apparatus that includes a pressing member and a light source producing a laser beam. The process begins with a bottom package that consists of a lower substrate, lower solder balls, and a lower chip. The bottom package is bonded to an interposer substrate, which has upper solder balls aligned with the lower solder balls. A top package, featuring an upper substrate and an upper chip, is then bonded to the interposer substrate. During this process, the pressing member applies pressure to the interposer substrate against the bottom package, while the laser beam adheres the lower solder balls to the upper solder balls.
Another notable patent is for a universal flash storage (UFS) device and computing device that includes a storage UFS device for reporting buffer size based on reuse time after erase. This storage device comprises a nonvolatile memory device with multiple memory blocks and a controller that utilizes some of these blocks as a buffer area. The controller identifies memory blocks with an elapsed time after erase greater than a specified reuse time as an available buffer size, which is then provided to an external host device.
Career Highlights
Ohchul Kwon is currently employed at Samsung Electronics Co., Ltd., a leading global technology company. His work at Samsung has allowed him to be at the forefront of innovative electronic solutions. Kwon's expertise in packaging technology has made him a valuable asset to the company and the industry as a whole.
Collaborations
Kwon has collaborated with several talented individuals in his field, including Junho Cho and Seungjin Cheon. These collaborations have further enhanced his innovative capabilities and contributed to the success of his projects.
Conclusion
Ohchul Kwon is a distinguished inventor whose work in package-on-package technology and storage devices has made a significant impact on the electronics industry. His innovative