Samsung Electronics Co., Ltd.

Ohchul Kwon

Tea-Geon Kim

Seungjin Cheon

Junglae Jung

Junho Cho

Bubryong Lee

Geunwoo Kim

Seunghee Lee

Hyun Cheol Kim

Hyung-Kyun Byun

Young Joon Jang

Youngjoon Jang

Sangho An

Chun-Um Kong

Seonju Oh

Junki Kim

Yun-Sik Yoo

A method of manufacturing a package-on-package device includes a bonding step carried out by a bonding apparatus including a pressing member and a light source that produces a laser beam. A bottom package including a lower substrate, lower solder balls alongside an edge of the lower substrate, and a lower chip on a center of the lower substrate is provided, the bottom package is bonded to an interposer substrate having upper solder balls aligned with the lower solder balls, and a top package having an upper substrate and an upper chip on the upper substrate is bonded to the interposer substrate. While the interposer substrate is disposed on the bottom package, the pressing member presses the interposer substrate against the bottom package, and the laser beam adheres the lower solder balls to the upper solder balls.

Method of manufacturing package-on-package device and bonding apparatus used therein

A storage device includes a nonvolatile memory device that includes a plurality of memory blocks, and a controller that uses some memory blocks of the plurality of memory blocks as a buffer area. Memory blocks storing invalid data from among the some memory blocks are invalid memory blocks, and the controller identifies memory blocks, of which an elapsed time after erase is greater than a reuse time, from among the invalid memory blocks as an available buffer size, and provides the available buffer size to an external host device.

Universal flash storage (UFS) device and computing device and computing device including storage UFS device for reporting buffer size based on reuse time after erase

A nonvolatile memory device includes multiple memory blocks. A first memory block stores first data. A reference memory block stores an indicator indicating the first memory block as an indication in response to a first direct access command received from the outside. A first physical area of the first memory block is accessed according to a page address received from the outside together with the first direct access command, and the indication of the indicator.

Nonvolatile memory device configured to be accessed without block address and method of operating the same

An embodiment includes a substrate treating apparatus comprising: a tape supply member configured to supply a tape to be attached to a substrate; a tape collection member configured to collect a surplus tape that remains after the tape is attached to the substrate; a support member disposed between the tape supply member and the tape collection member and configured to support the substrate while the tape is attached to the substrate; and a temperature adjustment member configured to adjust a temperature of the tape that is supplied from the tape supply member to the support member.

Substrate treating apparatus and substrate treating method

Growing community of inventors

Suwon-si, South Korea

Ohchul Kwon