Suwon-si, South Korea

Sangho An


Average Co-Inventor Count = 3.6

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2016-2020

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3 patents (USPTO):Explore Patents

Title: Sangho An: Innovator in Semiconductor Technology

Introduction

Sangho An is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on enhancing the efficiency and reliability of electrical connections in semiconductor devices.

Latest Patents

Sangho An's latest patents include innovative solutions such as a bonding wire featuring a silver alloy core, a wire bonding method utilizing this bonding wire, and an electrical connection part of a semiconductor device that employs the bonding wire. The bonding wire consists of a wire core made from a silver-palladium alloy, with a coating layer on the sidewall of the wire core. The palladium content in the silver-palladium alloy ranges from approximately 0.1 wt % to about 1.5 wt %. Additionally, he has developed a substrate treating apparatus and method, which includes a tape supply member for attaching tape to a substrate, a tape collection member for surplus tape, a support member for substrate support, and a temperature adjustment member for regulating the tape's temperature.

Career Highlights

Sangho An is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing advanced materials and methods that enhance the performance of electronic devices.

Collaborations

He collaborates with talented coworkers, including Geunwoo Kim and Seunghee Lee, contributing to a dynamic team environment that fosters innovation and creativity.

Conclusion

Sangho An's contributions to semiconductor technology through his patents and work at Samsung Electronics Co., Ltd. highlight his role as a key innovator in the industry. His advancements in bonding wires and substrate treatment methods are paving the way for future developments in electronic devices.

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