Introduction: Seok-Hwan Ahn, an accomplished inventor based in Seongnam-si, South Korea, has made significant contributions to the field of electronics through his innovative patents. With a total of six patents to his name, Ahn is recognized for his expertise in developing advanced multilayered substrates and embedded boards.

Latest Patents: Among his recent innovations, Ahn's patent for a multilayered substrate and method for manufacturing the same stands out. This invention features an insulating layer, a partially embedded conductive pattern, and an electrically connected bump that penetrates the insulating layer. The bump comprises two metal layers with varying melting points to enhance functionality. Another noteworthy patent is for an embedded board and method of manufacturing the same, which includes an insulating layer containing multiple circuit layers and components, designed to optimize space and efficiency in electronic designs.

Career Highlights: Ahn's work is affiliated with Samsung Electro-Mechanics Co., Ltd., a leader in the electronics industry known for its commitment to innovation. His patents reflect cutting-edge technology and a deep understanding of electronic manufacturing processes.

Collaborations: Throughout his career, Ahn has collaborated with talented colleagues such as Mi-Sun Hwang and Young-Gwan Ko. Their teamwork has played a vital role in advancing projects that push the boundaries of electronic substrate technology.

Conclusion: Seok-Hwan Ahn's patents underscore his talent and dedication to improving electronic components. His innovative approach to multilayered substrates and embedded boards contributes significantly to the evolving landscape of technology. As Ahn continues to develop new ideas, his influence in the industry is likely to expand, further enhancing the capabilities of electronic devices.

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