The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2017
Filed:
Mar. 30, 2016
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-Si, KR;
Inventors:
Sung-Han Kim, Seoul, KR;
Han Kim, Yongin-Si, KR;
Mi-Sun Hwang, Suwon-Si, KR;
Sang-Yul Ha, Hwaseong-Si, KR;
Seok-Hwan Ahn, Seongnam-Si, KR;
Kyung-Ho Lee, Suwon-Si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 3/10 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H05K 1/0298 (2013.01); H05K 1/115 (2013.01); H05K 3/0017 (2013.01); H05K 3/10 (2013.01); H05K 3/4644 (2013.01); H05K 2201/2009 (2013.01);
Abstract
A printed circuit board and a method of manufacturing the same is provided. The printed circuit board includes an insulating substrate, a circuit disposed on the insulating substrate, a pair of first reinforcements spatially separated in the insulating substrate, the first reinforcements extending parallel to a surface of the insulating substrate, and a second reinforcement configured to connect the pair of first reinforcements.