The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2019
Filed:
Nov. 13, 2017
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Seok-Hwan Ahn, Yongin-si, KR;
Mi-Sun Hwang, Suwon-si, KR;
Young-Gwan Ko, Hwaseong-si, KR;
Jong-Seok Bae, Yongin-si, KR;
Myung-Sam Kang, Hwaseong-si, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Abstract
A multilayered substrate in accordance with an aspect of the present disclosure may include an insulating layer, a conductive pattern embedded, at least partially, in the insulating layer, and a bump being electrically connected to the conductive pattern and penetrating the insulating layer. The bump may include a low melting point metal layer having a melting point lower than a melting point of the conductive pattern and a high melting point metal layer having a melting point higher than the melting point of the low melting point metal layer and having a latitudinal cross-sectional area smaller than a latitudinal cross-sectional area of the low melting point metal layer.