The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2017
Filed:
Jun. 29, 2016
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Seok-Hwan Ahn, Seongnam-si, KR;
Mi-Sun Hwang, Suwon-si, KR;
Young-Gwan Ko, Seoul, KR;
Jong-Seok Bae, Yongin-si, KR;
Myung-Sam Kang, Hwaseong-si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); H05K 1/09 (2013.01); H05K 1/115 (2013.01); H05K 3/007 (2013.01); H05K 3/0076 (2013.01); H05K 3/12 (2013.01); H05K 3/4007 (2013.01); H05K 3/4623 (2013.01); H05K 2203/043 (2013.01);
Abstract
A multilayered substrate includes unit substrates laminated in a direction of thickness thereof, and the unit substrates include a photosensitive insulating layer, a conductive pattern disposed in the photosensitive insulating layer, and a bump penetrating into the photosensitive insulating layer and providing an interlayer connection to the conductive pattern.