Niigata, Japan

Senlin Fu

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Globalwafers Japan Co., Ltd.. Active years: 2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Senlin Fu. Retrieved from https://idiyas.com/inventor/senlin-fu-p0v7g8ay

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 13.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2013

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1 patent (USPTO):Explore Patents

Title: The Innovative Mind of Senlin Fu: A Pioneer in Silicon Wafer Technology

Introduction: Senlin Fu, an inventive mind based in Niigata, Japan, has made significant contributions to the semiconductor industry through his innovative approach to silicon wafer manufacturing. With a focus on enhancing the quality and efficiency of silicon wafers, Fu holds a patent that addresses critical challenges in the production process.

Latest Patents: Senlin Fu's notable patent outlines a "Method of manufacturing single crystal silicon wafer from ingot grown by Czochralski process with rapid heating/cooling process." This patent describes a unique process wherein a silicon wafer, derived from a Czochralski-grown single crystal ingot, is subjected to rapid heating and cooling at temperatures ranging from 1300°C to less than 1380°C. This process occurs in an oxidizing gas atmosphere with an oxygen partial pressure of 20% or more but less than 100%. The resultant silicon wafer exhibits a defect-free region, referred to as the DZ layer, which is critical for active device regions. Moreover, it possesses a high oxygen concentration with a solid solution of 0.7×10 atoms/cm or more and interstitial silicon in a supersaturated state.

Career Highlights: Currently, Senlin Fu is associated with Globalwafers Japan Co., Ltd., a company renowned for its advancements in silicon wafer technology. His expertise and innovative methods have positioned him as a valuable asset in the field, demonstrating a commitment to excellence in wafer manufacturing.

Collaborations: Throughout his career, Fu has collaborated with talented professionals such as Hiromichi Isogai and Takeshi Senda. Their teamwork has likely contributed to the refinement of techniques and the successful implementation of groundbreaking technologies in their projects.

Conclusion: Senlin Fu's innovative contributions to the field of silicon wafer manufacturing illustrate the vital role that inventors play in advancing technology. His patented method not only enhances the quality of silicon wafers but also reflects his dedication to overcoming challenges within the semiconductor industry. As the demand for high-quality silicon wafers grows, the impact of Fu's work is likely to resonate for years to come.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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