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For the Inventor, By the Inventor

Simpang Ampat, Mali

Seng Hooi Ong

This inventor holds 3 USPTO granted patents. Top assignee: Intel Corporation. Active years: 2002-2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Seng Hooi Ong. Retrieved from https://idiyas.com/inventor/seng-hooi-ong

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3

% Patents Active = 66.7

Average Co-Inventor Count = 3.0

ph-index = 3

Forward Citations = 51(Granted Patents)


Location History:

  • Simpang Ampat, ML (2002)
  • Simpang Ampat, MY (2002)
  • Penang, MY (2003)

Company Filing History:

goldMedal3 out of 56,322 
 
Intel Corporation
 patents

Years Active: 2002-2003

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3 patents (USPTO):Explore Patents
1. 6664483 - Electronic package with high density interconnect and associated methods (2003-12-16),
2. 6501166 - Stitched plane structure and process for package power delivery and dual referenced stripline I/O performance (2002-12-31),
3. 6429051 - Stitched plane structure for package power delivery and dual referenced stripline I/O performance (2002-08-06),

Title: Seng Hooi Ong: Pioneering Innovations in Technology

Introduction:

Renowned inventor Seng Hooi Ong, hailing from Simpang Ampat, ML, has carved a path of innovation, inspiring the next generation of inventors with his dedication to excellence and groundbreaking technological advancements. With a strong passion for pushing the boundaries of what is possible, Seng Hooi Ong has made a lasting impact on the world of technology.

Latest Patents:

Among his impressive portfolio of inventions, Seng Hooi Ong's latest patents stand out for their ingenuity and technical sophistication. One of his recent patents includes an "Electronic package with high density interconnect and associated methods," revolutionizing the way integrated circuits are coupled to substrates in a flip-chip ball grid array configuration. Another notable patent is the "Stitched plane structure and process for package power delivery and dual referenced stripline I/O performance," optimizing power delivery and signal integrity in microelectronic packages.

Career Highlights:

Seng Hooi Ong has been a driving force behind technological advancements at Intel Corporation, where he applies his expertise in semiconductor packaging and electronic system design. His innovative solutions have earned him recognition as a trailblazer in the field, continuously pushing the boundaries of what is thought possible in the realm of technology.

Collaborations:

In his pursuit of excellence, Seng Hooi Ong has collaborated with esteemed colleagues such as Dustin P Wood and Edward Allyn Burton. Together, they have worked towards developing cutting-edge solutions that address the complex challenges of modern electronics and pave the way for future innovations.

Conclusion:

Seng Hooi Ong's unwavering commitment to innovation and his relentless pursuit of excellence continue to shape the future of technology. Through his groundbreaking inventions and collaborative spirit, he inspires the next generation of inventors to dream big and push the boundaries of what is possible in the world of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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