Coppell, TX, United States of America

Seiya Takashima

This inventor holds 1 USPTO granted patent. Top assignee: Sumitomo Electric Device Innovations, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Seiya Takashima. Retrieved from https://idiyas.com/inventor/seiya-takashima

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Seiya Takashima: Semiconductor Device Inventor

Introduction

Seiya Takashima is an inventor associated with Coppell, Texas, and Sumitomo Electric Device Innovations, Inc. His patent work addresses semiconductor packaging and the electrical performance of output connections.

Latest Patents

Takashima is credited with 1 patent: “Output Matching Network to Reduce Self and Mutual Inductances of Output Inductive Components in a Cavity Package.” The invention describes a semiconductor device with a transistor die and a separate substrate positioned inside a cavity package. Shunt and output wires connect the transistor’s output to the substrate and an output lead. Their placement and shape are designed to reduce self-inductance and mutual inductance, supporting improved output matching.

Career Highlights

Takashima’s listed patent reflects work on the design of semiconductor devices and cavity packages. The invention focuses on managing inductance in output connections through the arrangement of wires and package components.

Collaborations

The patent is associated with Sumitomo Electric Device Innovations, Inc., connecting Takashima’s inventive work with the company’s semiconductor-device activities.

Conclusion

Seiya Takashima’s patent centers on reducing unwanted inductance in a cavity-packaged semiconductor device through carefully designed output connections.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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