Seiji Mori

Title: Seiji Mori: Innovator in Wiring Substrate Technology

Introduction

Seiji Mori is a prominent inventor based in Kounan, Japan, known for his significant contributions to wiring substrate technology. With a total of 15 patents to his name, Mori has developed innovative solutions that enhance the functionality and reliability of electrical components.

Latest Patents

Mori's latest patents include a wiring substrate and a production method for it. This wiring substrate features a surface layer with electrical insulation properties and a connection terminal that has electrical conduction properties, protruding from the surface layer. The connection terminal consists of a base portion made of an electrically conductive first metal, a covering portion made of a second metal with a lower melting point, and a filling portion that can include an alloy of the first and second metals. Another notable patent is for a wiring board designed to ensure adhesion strength of connecting terminals, preventing them from falling over or peeling off during the fabrication process. This wiring board includes a laminated body with multiple layers of insulating and conductor layers, along with a filling member positioned lower than the height of the connecting terminals.

Career Highlights

Throughout his career, Seiji Mori has worked with notable companies such as NGK Spark Plug Company, Limited and NGK Spark Plus Co., Ltd. His work in these organizations has allowed him to refine his expertise in electrical components and wiring technologies.

Collaborations

Mori has collaborated with talented individuals in the field, including Makoto Wakazono and Tomohiro Nishida. These collaborations have contributed to the advancement of his innovative projects and patents.

Conclusion

Seiji Mori's contributions to wiring substrate technology and his impressive portfolio of patents highlight his role as a key innovator in the field. His work continues to influence the development of reliable electrical components.