The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2016
Filed:
May. 17, 2013
Ngk Spark Plug Co., Ltd., Nagoya-shi, Aichi, JP;
Takahiro Hayashi, Komaki, JP;
Makoto Nagai, Komaki, JP;
Seiji Mori, Kounan, JP;
Tomohiro Nishida, Mizuho, JP;
Makoto Wakazono, Niwa-gun, JP;
Tatsuya Ito, Kakamigahara, JP;
NGK SPARK PLUG CO., LTD., Nagoya, JP;
Abstract
To provide a wiring board excellent in connection reliability with a semiconductor chip. A first buildup layerwhere resin insulating layersandand a conductor layerare laminated is formed at a substrate main surfaceside of an organic wiring board. The conductor layerfor an outermost layer in the first buildup layerincludes a plurality of connecting terminal portionsfor flip-chip mounting a semiconductor chip. The plurality of connecting terminal portionsis exposed through an opening portionof a solder resist layer. Each connecting terminal portionincludes a connection regionfor a semiconductor chip and a wiring regiondisposed to extend from the connection regionalong the planar direction. The solder resist layerincludes, within the opening portion, a side-surface covering portionthat covers the side surface of the connecting terminal portionand a projecting wall portionthat is integrally formed with the side-surface covering portionand disposed to project so as to intersect with the connection region