The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2016

Filed:

May. 16, 2012
Applicants:

Tatsuya Ito, Kakamigahara, JP;

Seiji Mori, Kounan, JP;

Takahiro Hayashi, Komaki, JP;

Makoto Wakazono, Niwa-gun, JP;

Tomohiro Nishida, Mizuho, JP;

Inventors:

Tatsuya Ito, Kakamigahara, JP;

Seiji Mori, Kounan, JP;

Takahiro Hayashi, Komaki, JP;

Makoto Wakazono, Niwa-gun, JP;

Tomohiro Nishida, Mizuho, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01); H01L 23/498 (2006.01); H05K 3/34 (2006.01); H05K 3/46 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0213 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H05K 1/111 (2013.01); H05K 3/3452 (2013.01); H05K 3/4007 (2013.01); H01L 23/145 (2013.01); H01L 23/49894 (2013.01); H01L 2924/0002 (2013.01); H05K 3/3436 (2013.01); H05K 3/4661 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/099 (2013.01); H05K 2201/09881 (2013.01); H05K 2201/09918 (2013.01); Y02P 70/611 (2015.11);
Abstract

A wiring substrate according to the present invention includes a laminate of one or more insulation layers and one or more conductive layers and further includes a plurality of connection terminals formed on the laminate and spaced apart from one another, each having a step formed at the outer periphery of a first main surface opposite a contact surface in contact with the laminate, and a filling member provided in a filling manner between the connection terminals.


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