The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2017

Filed:

Apr. 10, 2013
Applicant:

Ngk Spark Plug Co., Ltd., Nagoya-shi, Aichi, JP;

Inventors:

Tomohiro Nishida, Mizuho, JP;

Seiji Mori, Konan, JP;

Makoto Wakazono, Niwa-gun, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/34 (2006.01); H05K 3/28 (2006.01); H01L 23/498 (2006.01); H05K 3/24 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0213 (2013.01); H01L 23/49811 (2013.01); H05K 3/3452 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 2924/0002 (2013.01); H05K 1/111 (2013.01); H05K 3/244 (2013.01); H05K 3/28 (2013.01); H05K 2201/099 (2013.01); H05K 2201/09881 (2013.01); H05K 2203/0571 (2013.01); H05K 2203/0588 (2013.01);
Abstract

To provide a wiring substrate which can prevent short circuit between connection terminals, and which realizes reduction of the pitch between the connection terminals. The wiring substrate of the present invention includes a layered structure including one or more insulation layers and one or more conductor layers, and the wiring substrate is characterized in that a plurality of connection terminals are formed on the layered structure so as to be separated from one another; a filling member is filled between the connection terminals; and each of the connection terminals has a side surface composed of a contact surface which is in contact with the filling member, and a spaced surface which is not in contact with the filling member and which is located above the contact surface and below the top surface of the filling member.


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