Sherman, TX, United States of America

Sean Michael Malolepszy


Average Co-Inventor Count = 2.5

ph-index = 2

Forward Citations = 41(Granted Patents)


Company Filing History:


Years Active: 2003-2012

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9 patents (USPTO):Explore Patents

Title: Sean Michael Malolepszy: Innovator in Integrated Circuit Technology

Introduction

Sean Michael Malolepszy is a prominent inventor based in Sherman, Texas. He has made significant contributions to the field of integrated circuit technology, holding a total of nine patents. His innovative work focuses on enhancing the efficiency and effectiveness of wirebonding processes in integrated circuits.

Latest Patents

One of Sean's latest patents is for a dual capillary IC wirebonding apparatus. This invention discloses methods for forming bond wires in integrated circuit assemblies by attaching two separate wires using a dual capillary bond head. The separate wires are preferably non-identical, which may involve different gauges and material compositions. A preferred embodiment of this invention includes a rotatable ultrasonic horn with a pair of capillaries that dispense separate strands of bond wire and form bonds on bond targets. Additionally, the patent outlines a method for dual capillary IC wirebonding that involves using two dual capillary bond heads to contemporaneously attach non-identical bond wires to selected bond targets on one or more IC package assemblies.

Career Highlights

Sean Michael Malolepszy has built a successful career at Texas Instruments Corporation, where he has been instrumental in advancing wirebonding technology. His expertise and innovative mindset have led to the development of several patents that enhance the performance of integrated circuits.

Collaborations

Throughout his career, Sean has collaborated with notable colleagues, including Rex Warren Pirkle and David Joseph Bon. These partnerships have contributed to the successful development of his inventions and patents.

Conclusion

Sean Michael Malolepszy is a key figure in the field of integrated circuit technology, with a strong portfolio of patents that reflect his innovative spirit. His work continues to influence advancements in wirebonding processes, showcasing his commitment to improving technology in the industry.

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