The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2003

Filed:

Jan. 30, 2002
Applicant:
Inventors:

Sean Michael Malolepszy, Sherman, TX (US);

Peter J. Sakakini, Frisco, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/166 ;
U.S. Cl.
CPC ...
H01L 2/166 ;
Abstract

Thick film bond surfaces ( ) on a support structure ( ), such as a ceramic substrate or an IC package substrate, tend to deform during processing. A personality kit ( ) having raised bosses ( ) engages with and compresses the bond surfaces, resulting in a flatter, wider bond surface having improved reflectivity. The personality kit ( ) is fit within a clamp ( ) that can be used as a stand-alone unit or integrated into an existing machine, such as a wire bonder ( ).


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