This inventor holds 2 USPTO granted patents. Top assignees: Custom Sensors & Technologies, Inc., Dpa Labs, Incorporated. Active years: 2002-2008.
Company Filing History:
Years Active: 2002-2008
Title: Scott McDaniel: Innovator in Sensor Technology and Semiconductor Packaging
Introduction
Scott McDaniel is a notable inventor based in Simi Valley, California. He has made significant contributions to the fields of sensor technology and semiconductor packaging. With a total of 2 patents, McDaniel's work showcases his innovative approach to solving complex engineering challenges.
Latest Patents
One of McDaniel's latest patents is for preformed sensor housings and methods to produce thin metal diaphragms. This invention includes a preformed sensor housing that features a conduit with an inside, a plug within the conduit, and a deposit that covers portions of both the plug and the conduit. Additionally, he has developed a method for creating a thin film diaphragm on a housing, which involves inserting a sacrificial element, depositing diaphragm material, and subsequently removing the sacrificial element.
Another significant patent involves a process to remove semiconductor chips from a plastic package. This innovative process allows for the removal of a semiconductor die from its plastic packaging and reassembly into a high-reliability hermetic package. The method employs a unique disassembly and etching process, enhancing the reliability of the die by reattaching it and rebonding new die wires using a "bond-on-top-of-bond" technique. A novel bond-flattening tool is also utilized to precondition the original bondfoot on the removed die.
Career Highlights
Throughout his career, Scott McDaniel has worked with various companies, including DPA Labs, Incorporated and Custom Sensors & Technologies, Inc. His experience in these organizations has contributed to his expertise in sensor technology and semiconductor applications.
Collaborations
McDaniel has collaborated with notable individuals in his field, including Philip L. Young and Douglas Young. These partnerships have likely fostered innovation and the exchange of ideas in their respective projects.
Conclusion
Scott McDaniel's contributions to sensor technology and semiconductor packaging demonstrate his innovative spirit and technical expertise. His patents reflect a commitment to advancing technology in these critical areas.