The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2002
Filed:
Aug. 23, 2001
Philip Young, Simi Valley, CA (US);
Douglas Young, Simi Valley, CA (US);
Scott McDaniel, Simi Valley, CA (US);
Gary Bivins, Tujunga, CA (US);
William S. Ditto, Chatsworth, CA (US);
Huong Kim Lam, Simi Valley, CA (US);
DPA Labs, Incorporated, Simi Valley, CA (US);
Abstract
A process to remove a semiconductor die from a plastic package and then to reassemble the die in a high reliability hermetic package. The process is used to remove an already existing die using a unique disassembly and etching process and make the removed die more reliable by reattaching the die and rebonding all new die wires into either a hermetic package or a different type of package with a “bond-on-top-of-bond” technique. The original bondfoot on the removed die may be first preconditioned by a novel bond-flattening tool, which can be attached to the bond-head chuck of any wirebonder. Also, the die can be used in other applications with different pin-outs or configurations.