This inventor holds 1 USPTO granted patent. Top assignee: Dpa Labs, Incorporated. Active years: 2002.
Company Filing History:
Years Active: 2002
Title: The Innovative Contributions of William S. Ditto
Introduction
William S. Ditto is a notable inventor based in Chatsworth, CA (US). He has made significant contributions to the field of semiconductor technology. His innovative approach has led to the development of a unique process that enhances the reliability of semiconductor chips.
Latest Patents
William S. Ditto holds a patent for a process to remove semiconductor chips from a plastic package. This process involves the removal of a semiconductor die from its plastic packaging and reassembling it in a high-reliability hermetic package. The method utilizes a unique disassembly and etching process, which not only facilitates the removal of the die but also improves its reliability. The reattachment of the die and rebonding of new die wires can be accomplished using a "bond-on-top-of-bond" technique. Additionally, a novel bond-flattening tool can be employed to precondition the original bondfoot on the removed die, ensuring compatibility with various applications.
Career Highlights
William S. Ditto is associated with DPA Labs, Incorporated, where he continues to innovate in the semiconductor field. His work has garnered attention for its practical applications and potential to improve semiconductor reliability.
Collaborations
William has collaborated with notable colleagues, including Philip L. Young and Douglas Young. Their combined expertise has contributed to advancements in semiconductor technology.
Conclusion
William S. Ditto's innovative work in semiconductor technology exemplifies the impact of dedicated inventors in enhancing the reliability of electronic components. His contributions continue to influence the industry and pave the way for future advancements.