Custom Sensors & Technologies, Inc.

Dpa Labs, Incorporated

Scott McDaniel

Marcos A Nassar

Philip L Young

Gary Bivins

Huong Kim Lam

Douglas Young

William S Ditto

A preformed sensor housing including a conduit having an inside; a plug disposed within the conduit; and a deposit covering a portion of the plug and a portion of the conduit. A method is also disclosed for creating a thin film diaphragm on a housing including the step of inserting a sacrificial element into the housing; depositing a diaphragm material onto the sacrificial element and the housing; and removing the sacrificial element.

Preformed sensor housings and methods to produce thin metal diaphragms

A process to remove a semiconductor die from a plastic package and then to reassemble the die in a high reliability hermetic package. The process is used to remove an already existing die using a unique disassembly and etching process and make the removed die more reliable by reattaching the die and rebonding all new die wires into either a hermetic package or a different type of package with a &ldquo;bond-on-top-of-bond&rdquo; technique. The original bondfoot on the removed die may be first preconditioned by a novel bond-flattening tool, which can be attached to the bond-head chuck of any wirebonder. Also, the die can be used in other applications with different pin-outs or configurations.

Process to remove semiconductor chips from a plastic package

Growing community of inventors

Simi Valley, CA, United States of America

Scott McDaniel