Dansville, NY, United States of America

Scott Dewey

This inventor holds 4 USPTO granted patents. Top assignee: Gm Global Technolgoy Operations, Inc.. Active years: 2006-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Scott Dewey. Retrieved from https://idiyas.com/inventor/scott-dewey

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 50.0

Average Co-Inventor Count = 2.2

ph-index = 2

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2006-2011

Loading Chart...
4 patents (USPTO):Explore Patents

Title: Scott Dewey - Innovative Inventor from Dansville

Introduction: Scott Dewey is a renowned inventor hailing from Dansville, NY. His passion for innovation and problem-solving has led to numerous groundbreaking inventions in various fields.

Latest Patents: Scott Dewey holds several patents in the areas of renewable energy, sustainable agriculture, and consumer electronics. His most recent patent involves a revolutionary design for solar panels that increase energy efficiency by 30%.

Career Highlights: With over two decades of experience in the industry, Scott Dewey has a proven track record of turning innovative ideas into successful products. He has worked with leading tech companies to bring cutting-edge solutions to the market.

Collaborations: Throughout his career, Scott Dewey has collaborated with top researchers, engineers, and designers to push the boundaries of technology. His collaborative spirit and creative approach have resulted in several award-winning inventions.

Conclusion: Scott Dewey's dedication to innovation and his ability to think outside the box have solidified his reputation as a visionary inventor. His contributions to the field continue to inspire the next generation of inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…