Saga, Japan

Satoshi Teshima

This inventor holds 3 USPTO granted patents. Top assignee: Tanaka Denshi Kogyo K.k.. Active years: 2012-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Satoshi Teshima. Retrieved from https://idiyas.com/inventor/satoshi-teshima-e0n12l2q

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 33.3

Average Co-Inventor Count = 2.8

ph-index = 1

Forward Citations = 1(Granted Patents)


Location History:

  • Saga-ken, JP (2013)
  • Saga, JP (2012 - 2015)

Company Filing History:


Years Active: 2012-2015

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3 patents (USPTO):Explore Patents

Title: **Innovator Spotlight: Satoshi Teshima from Saga, JP**

Introduction

Satoshi Teshima is a distinguished inventor based in Saga, Japan, known for his contributions to the field of semiconductor technology. With a commendable portfolio that includes three patents, Teshima has made significant advancements in bonding wire materials that enhance the efficiency and performance of semiconductor devices.

Latest Patents

Satoshi Teshima's latest patents showcase his innovative approach to bonding wire technology for semiconductor applications. One of his notable inventions is the **Ag—Au—Pd Ternary Alloy Bonding Wire**, specifically designed for semiconductor devices. This wire is composed of 4-10 mass % of gold with a purity of 99.999% or higher, 2-5 mass % of palladium with a purity of 99.99% or higher, and the remaining mass of silver, also with high purity. This bonding wire incorporates 15-70 mass ppm of oxidizing non-noble metallic elements, undergoes thermal annealing before being continuously drawn, and is thermally tempered after production. It is particularly valuable for ball bonding in a nitrogen atmosphere, effectively minimizing corrosion through the formation of AgAl and a palladium-rich layer at the interface.

Another patent is the **Au Bonding Wire for Semiconductor Devices**, which consists of an alloy material formulated with various functional elements. This wire features 3-15 mass ppm of Beryllium, 3-40 mass ppm of Calcium, 3-20 mass ppm of Lanthanum, and additional elements like Cerium, Europium, Magnesium, and Silicon, with the remainder being gold. Notably, this Au alloy bonding wire is designed with a diameter of less than 23 microns and showcases improved roundness in compressed bonded balls along with enhanced fracture stress, making it an advancement in the bonding wire industry.

Career Highlights

Teshima's impressive career is highlighted by his ongoing work with Tanaka Denshi Kogyo Co., Ltd., a company renowned for its technological innovations in the electronics sector. He has demonstrated an unwavering commitment to research and development, leading to multiple patented advancements in materials science.

Collaborations

Throughout his career, Satoshi Teshima has collaborated with other talented inventors, such as Jun Chiba and Tasuku Kobayashi. These partnerships reflect a robust teamwork environment conducive to innovation and problem-solving within the semiconductor field.

Conclusion

Satoshi Teshima's work exemplifies the spirit of innovation in the semiconductor industry. His patents demonstrate a steadfast dedication to developing materials that not only improve the functionality of devices but also address critical operational challenges. As technology continues to evolve, Teshima's contributions will undoubtedly play a significant role in shaping the future of semiconductor applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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