The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2015
Filed:
Nov. 01, 2011
Jun Chiba, Saga, JP;
Satoshi Teshima, Saga, JP;
Tasuku Kobayashi, Saga, JP;
Yuki Antoku, Saga, JP;
TANAKA DENSHI KOGYO K.K., Tokyo, JP;
Abstract
An Ag—Au—Pd ternary alloy bonding wire for semiconductor devices made from 4-10 mass % of gold having a purity of 99.999% or higher, 2-5 mass % of palladium having a purity of 99.99% or higher, and remaining mass % of silver (Ag) having a purity of 99.999% or higher; and this wire contains 15-70 mass ppm of oxidizing non-noble metallic elements, and is thermally annealed before being continuously drawn through dies, and is thermally tempered after being continuously drawn through the dies, and this wire is useful for ball bonding in a nitrogen atmosphere; AgAl and a Pd rich layer produced in the interface between the Ag—Au—Pd ternary alloy wire and an aluminum pad suppress the corrosion development between the AgAl intermetallic compound layer and the wire.