The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2012
Filed:
Jun. 23, 2008
Applicants:
Mitsuo Takada, Saga, JP;
Satoshi Teshima, Saga, JP;
Takeshi Kuwahara, Saga, JP;
Inventors:
Assignee:
Tanaka Denshi Kogyo KK, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C 5/02 (2006.01); B22D 3/00 (2006.01); B22D 5/00 (2006.01); H01F 1/16 (2006.01); H02G 3/04 (2006.01);
U.S. Cl.
CPC ...
Abstract
There is provided a gold alloy wire for a ball bonding. The gold alloy consists of 10 to 50 ppm by mass of magnesium (Mg); 5 to 20 ppm by mass of europium (Eu); 2 to 9 ppm by mass of calcium (Ca); and a remaining portion being gold (Au) having a purity of a minimum of 99.998% by mass. In the gold alloy wire for a ball bonding, an addition amount of calcium (Ca) is a maximum of half that of europium (Eu).
Takada, Mitsuo. (2012). Gold alloy wire for ball bonding (U.S. Patent No. 8147750). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8147750
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile