Hachioji, Japan

Satoshi Enokido


Average Co-Inventor Count = 1.9

ph-index = 5

Forward Citations = 57(Granted Patents)


Location History:

  • Tachikawa, JP (1998)
  • Hachioji, JP (2002 - 2008)

Company Filing History:


Years Active: 1998-2008

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11 patents (USPTO):Explore Patents

Title: Innovations by Satoshi Enokido in Bonding Technology

Introduction

Satoshi Enokido, a skilled inventor based in Hachioji, Japan, has made significant contributions to the field of bonding technologies. With a remarkable portfolio of 11 patents, Enokido's work has advanced the methodology and precision involved in the bonding process of chips, which is crucial in various technological applications.

Latest Patents

Among his most recent innovations are two notable patents. The first, the "Bonding Program," involves deriving the coordinates of a new imaging range based on known positional data of various patterns on chips. This process enhances the precision of bonding by carefully determining the inclination-angle of the first positioning pattern of the bonding object chip. By doing so, the imaging range can be narrowed, and the second positioning pattern can be captured more accurately.

The second patent, the "Bonding Pattern Discrimination Device," focuses on the determination of inclination of positioning patterns used in bonding. This device utilizes imaging techniques to compare a reference-image of a positioning pattern against an object-image of the bonding chip. Through polar coordinate conversions, the inclination-angle is calculated, allowing for a more precise alignment during the bonding process.

Career Highlights

Enokido's career is marked by his role at Kabushiki Kaisha Shinkawa, where he has contributed to various innovations in the bonding domain. His extensive work in the field has not only led to a substantial number of patents but has also improved the methodologies employed in modern chip bonding.

Collaborations

Throughout his career, Satoshi Enokido has collaborated with talented individuals such as Shigeru Hayata and Ryuichi Kyomasu. These collaborations have fostered an environment of creativity and innovation, leading to the development of groundbreaking technologies in bonding practices.

Conclusion

Satoshi Enokido's relentless pursuit of innovation in bonding technologies has made him a noteworthy figure in the field. With an impressive 11 patents to his name, his contributions have significantly impacted the precision and efficiency of chip bonding processes, ensuring that his work will influence future technological advancements for years to come.

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