Kabushiki Kaisha Shinkawa

Satoshi Enokido

Ryuichi Kyomasu

Shigeru Hayata

Toshiaki Sasano

Kenji Sugawara

Hiromi Tomiyama

Takeyuki Nakagawa

Yoshiyuki Ogata

With an assumption that the three data of the position (X, Y) of the first positioning patternand position (X, Y) of the second positioning patternof the reference chip, and the position (X, Y) of the first positioning patternof the bonding object chip, as well as the length L of a line segment connecting (X, Y) and (X, Y), and the angle &#x3b8;of this line segment with respect to the X axis, are known, the coordinates (X, Y) of the center position of the imaging rangethat is to be imaged next is determined by detecting the inclination-angle &#x394;&#x3b8; of the first positioning patternof the bonding object chip. Furthermore, the imaging range can be narrowed and the second positioning patterncan be captured by increasing the precision of &#x394;&#x3b8;.

Bonding program

Bonding apparatus

Determination of inclination of positioning patterns used in bonding being made by: imaging a positioning pattern of reference chip and taking such image as reference-image; specifying a polar coordinate conversion origin for the reference-image; imaging an object (chip) of bonding to use it as an object-image, thus obtaining a relative positional-relationship with the reference-image; specifying the polar coordinate conversion origin of the object-image, so that the object-image is subjected to a polar coordinate conversion; and calculating inclination-angle from both images that have been subjected to a polar coordinate conversion; thus using a point, in which an error in position of the object of comparison detected by pattern matching between an image, which is the object of comparison obtained by imaging the object of comparison disposed in an attitude that includes positional deviation, and the reference-image, shows a minimal value, as an origin of the polar coordinate conversion.

Bonding pattern discrimination device

Bonding pattern discrimination program

Bonding pattern discrimination method, bonding pattern discrimination device and bonding pattern discrimination program

Bonding method, bonding apparatus and bonding program

In measuring the position of a bonding tool accurately in offset correction in a bonding apparatus, the tool is moved to approach a reference member, the tool is illuminated with a reference pattern by a laser diode, and the deviation between the reference member and tool in one horizontal direction is measured based upon the image of the reference pattern projected on the tool. A position detection camera images the tool in another horizontal direction, thus measuring the deviation of the tool and reference member. The position detection camera is moved to approach the reference member, and the deviation between the position detection camera and the reference member is measured by the position detection camera. The accurate offset amounts between the position detection camera and the tool are determined based upon these measured values and amounts of movement of the position detection camera and the tool.

Offset measurement method, tool position detection method and bonding apparatus

Wire bonding method and apparatus in which axial center of a bonding tool is brought to a reference member, and light-emitting diodes are sequentially lit so that images of the reference member and bonding tool in the X and Y directions are acquired by an offset correction camera. In this way, the amount of deviation between the bonding tool and the reference member is measured. Then, a position detection camera is caused to approach the reference member, and the amount of deviation between the optical axis of the position detection camera and the reference member is measured by the position detection camera. The accurate offset amount are determined on the basis of these measured values and the amounts of movement.

Bonding apparatus and bonding method

A wire bonding apparatus and method in which an axial center of a bonding tool is moved to the vicinity of a near reference member, laser diodes are sequentially lit, images of the reference member and bonding tool in the horizontal directions are acquired by a position detection camera, and amounts of deviation between the tool and the reference member are measured. Then, the position detection camera is caused to approach the reference member, and amounts of deviation between the optical axis of the position detection camera and the reference member are measured by the position detection camera. The accurate offset amounts are determined from the measured values and amounts of movement. Image light of the tool and reference member is conducted to the position detection camera by prisms and half-mirror, without a camera for detecting the amount of deviation between the tool and reference member.

Workpieces in which, for example, wire bonding has been performed are inspected to determine if they are defective or not by an inspection device. Workpieces which have been found to be defective are conveyed to one workpiece magazine and workpieces which have been found to be defect-free are conveyed to another workpiece magazine, thus defective and non-defective workpieces are separated immediately after inspection.

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Hachioji, Japan

Satoshi Enokido