Company Filing History:
2 out of 131,611 
1 out of 27,040 
Years Active: 2017-2023
Title: Sangho Yun - Innovator in Wafer and Substrate Bonding Technologies
Introduction
Sangho Yun is an inventor based in Suwon-si, South Korea. He is known for his innovative approaches in the field of wafer and substrate bonding technologies. Although he currently holds no granted patents, his contributions to the field are noteworthy.
Latest Patent Applications
Sangho Yun has filed several patent applications that showcase his inventive capabilities. One of his latest applications is for a **WAFER BONDING APPARATUS**. This apparatus includes a first chuck designed to suction a first wafer, and a second chuck for a second wafer, featuring a plurality of bonding pin members that are individually operable. The design also incorporates vacuum regions adjacent to the bonding pin members, enhancing the bonding process.
Another significant application is for a **SUBSTRATE BONDING APPARATUS**. This apparatus is designed to bond a first substrate to a second substrate. It includes a lower bonding chuck to support the first substrate and an upper bonding chuck for the second substrate. The system features a gas discharge device that discharges pressurized gas to the top surface of the second substrate, along with a controller that manages the gas discharge and the vertical movement of the device.
Conclusion
Sangho Yun is an emerging inventor whose latest patent applications reflect his innovative spirit in wafer and substrate bonding technologies. His work has the potential to contribute significantly to advancements in this field.