Sang-Yeop Lee

Title: The Innovations of Sang-Yeop Lee

Introduction

Sang-Yeop Lee is a prominent inventor based in Cheonan-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 8 patents. His work focuses on innovative methods and apparatuses that enhance the fabrication and packaging of semiconductor devices.

Latest Patents

One of Sang-Yeop Lee's latest patents is a method and apparatus for fabricating a semiconductor device by back grinding and dicing. This invention involves adhering a protection tape for back grinding on the front surface of a semiconductor wafer. The process includes back grinding the rear surface while the protection tape faces downward, loading the wafer into dicing equipment, detecting a dicing position, and dicing the wafer into individual chips. The dicing equipment features a transparent aligning part for precise alignment and a chuck part for support.

Another notable patent is for a semiconductor chip package that includes an adhesive tape attached to bonding wires. This invention improves the stability of the bonding wires during processing by encapsulating at least the upper portion of the wires adjacent to the active surfaces of the semiconductor chips.

Career Highlights

Sang-Yeop Lee is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to contribute to cutting-edge technologies in semiconductor fabrication and packaging.

Collaborations

Throughout his career, Sang-Yeop Lee has collaborated with talented individuals such as Min-Il Kim and In-Ku Kang. These collaborations have fostered innovation and advancement in their respective fields.

Conclusion

Sang-Yeop Lee's contributions to semiconductor technology through his patents and work at Samsung Electronics Co., Ltd. highlight his role as a key innovator in the industry. His inventions continue to influence the development of more efficient semiconductor devices.