Company Filing History:
Years Active: 2001-2004
Title: Innovations of Sang Jae Yun
Introduction
Sang Jae Yun is a notable inventor based in Kyungki-do, South Korea. He has made significant contributions to the field of technology, particularly in the development of carrier modules and test sockets for electronic devices. With a total of 4 patents to his name, Yun continues to push the boundaries of innovation.
Latest Patents
One of his latest patents is a carrier module for micro-BGA (μ-BGA) type devices. This invention allows for the testing of produced devices without damaging the solder ball underneath after being rapidly connected to a test socket. The carrier module comprises an upper and lower body with protrusions, a device receiving unit for μ-BGA type devices, and a spring secured elastically to the protrusions.
Another significant patent involves a wafer formed with a CSP device and a test socket for BGA devices. This invention features a test socket with a contact member that performs a wiping action to enhance electrical conductivity between the CSP device and the solder ball of the BGA device. The test socket includes a contact member block with a slanting face to apply uniform pressure to the solder ball surface, ensuring effective contact.
Career Highlights
Sang Jae Yun is currently employed at Mirae Corporation, where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of electronic testing and device reliability.
Collaborations
Yun collaborates with talented coworkers, including Back Woon Jung and Ki Hyun Lee, who contribute to his projects and innovations.
Conclusion
Sang Jae Yun's contributions to the field of technology through his patents and work at Mirae Corporation highlight his role as a significant inventor. His innovative solutions continue to impact the industry positively.