The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 2004
Filed:
Feb. 26, 2003
Applicant:
Inventor:
Sang Jae Yun, Kyungki-do, KR;
Assignee:
Mirae Corporation, Choongchungnam-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 3/102 ; G01R 3/126 ; H05K 7/20 ; H01R 1/200 ; B65D 7/302 ;
U.S. Cl.
CPC ...
G01R 3/102 ; G01R 3/126 ; H05K 7/20 ; H01R 1/200 ; B65D 7/302 ;
Abstract
The present invention relates to a carrier module for micro-BGA (&mgr;-BGA) type device which is capable of testing a produced device without damaging to a solder ball thereunder after being rapidly connected to a test socket. A carrier module for a &mgr;-BGA type device according to the present invention comprises: an upper and lower carrier module body formed with protrusions at the upper and lower portions thereof; a device receiving unit inserted to the upper carrier module body for receiving a &mgr;-BGA type device; and a spring secured elastically to the upper and lower protrusions by being inserted thereto.