Mirae Corporation

Sang Jae Yun

Ki Hyun Lee

Ki Hyun Jung

Back Woon Jung

The present invention relates to a carrier module for micro-BGA (&mgr;-BGA) type device which is capable of testing a produced device without damaging to a solder ball thereunder after being rapidly connected to a test socket. A carrier module for a &mgr;-BGA type device according to the present invention comprises: an upper and lower carrier module body formed with protrusions at the upper and lower portions thereof; a device receiving unit inserted to the upper carrier module body for receiving a &mgr;-BGA type device; and a spring secured elastically to the upper and lower protrusions by being inserted thereto.

Carrier module for &mgr;-BGA type device

The present invention relates to a carrier module for micro-BGA(&mgr;-BGA) type device which is capable of testing a produced device without damaging to a solder ball thereunder after being rapidly connected to a test socket. A carrier module for a &mgr;-BGA type device according to the present invention comprises: an upper and lower carrier module body formed with protrusions at the upper and lower portions thereof; a device receiving unit inserted to the upper carrier module body for receiving a &mgr;-BGA type device; and a spring secured elastically to the upper and lower protrusions by being inserted thereto.

Carrier module for holding a &mgr;-BGU type device for testing

The present invention relates to a wafer formed with a CSP device and a test socket of a BGA device in which a test socket has a contact member to perform a wiping action for increasing an electric conductivity between a wafer formed with a CSP device and a solder ball formed at a BGA device and a test socket. The present invention provides a test socket including: a contact member block having a slanting face to apply an uniform pressing force to the surface of a solder ball when a BGA device is contacted with the solder ball, formed with a two-dimensionally arranged long hole, the long hole being formed at its central portion with a through hole, the slanting face of the long hole and the surface of the through hole being coated with a conductive material; and a housing formed with a contact member block groove for mounting the contact member block and formed at the upper portion of the groove with a mounting portion for receiving a BGA device.

Wafer formed with CSP device and test socket of BGA device

There is disclosed a carrier module capable of accurately fixing IC device when the producted IC device is tested on the performance thereof. The carrier module includes a body having an insertion groove formed therein in a predetermined direction and holes, an elastic unit inserted and fixed to the insertion groove, for being elastically moved upward and downward, a latch installed on upper portion of the elastic means, for fixing an IC device, and a pin for fixing the latch by being inserted and fixed into the body, wherein the IC device is fixed or released by operation of the latch. The carrier module has a structure permitting the latches to be pressed at both sides thereof, and therefore the present invention provides an easy machining and assembling of the carrier module, and lowers the production cost by reducing the number of parts.

Growing community of inventors

Kyungki-do, South Korea

Sang Jae Yun