The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2003
Filed:
Dec. 22, 1999
Sang Jae Yun, Kyungki-do, KR;
Mirae Corporation, Choongchungnam-Do, KR;
Abstract
The present invention relates to a wafer formed with a CSP device and a test socket of a BGA device in which a test socket has a contact member to perform a wiping action for increasing an electric conductivity between a wafer formed with a CSP device and a solder ball formed at a BGA device and a test socket. The present invention provides a test socket including: a contact member block having a slanting face to apply an uniform pressing force to the surface of a solder ball when a BGA device is contacted with the solder ball, formed with a two-dimensionally arranged long hole, the long hole being formed at its central portion with a through hole, the slanting face of the long hole and the surface of the through hole being coated with a conductive material; and a housing formed with a contact member block groove for mounting the contact member block and formed at the upper portion of the groove with a mounting portion for receiving a BGA device.