Samuel Li

Title: Innovations of Samuel Li in Integrated Circuit Technology.

Introduction

Samuel Li is an accomplished inventor based in Tianjin, China. He has made significant contributions to the field of integrated circuit technology. With a total of 2 patents to his name, his work has garnered attention in the semiconductor industry.

Latest Patents

One of Samuel Li's latest patents is for a potted integrated circuit device with an aluminum case. This innovative device includes a die, a lead, and an electrically-conductive structure designed to facilitate electrical communication between the die and the lead. The device features a potting material that embeds the electrically conductive structure, the die, and part of the lead. An electrically-conductive housing encases the potting material, forming the exterior packaging of the device. During manufacturing, the arrangement of the electrically-conductive structure, the die, and part of the lead can occur either before or after the potting material is placed in the housing. When the integrated circuit device operates, heat is removable from the die through a thermal conduction path created by the electrically-conductive structure, the potting material, and the electrically-conductive housing.

Career Highlights

Samuel Li is currently employed at Vishay General Semiconductor, Inc., where he continues to innovate in the semiconductor field. His work has been instrumental in advancing integrated circuit technology, making significant impacts on the industry.

Collaborations

Samuel has collaborated with notable coworkers, including Peter Chou and Lucy Tian. Their combined expertise has contributed to the successful development of innovative technologies in their field.

Conclusion

Samuel Li's contributions to integrated circuit technology through his patents and collaborations highlight his role as a key innovator in the semiconductor industry. His work continues to influence advancements in this critical area of technology.