The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2013
Filed:
Jun. 11, 2012
Peter Chou, Taipei, TW;
Lucy Tian, Tianjin, CN;
Ivan Fu, Tianjin, CN;
Samuel LI, Tianjin, CN;
May-luen Chou, Taipei, TW;
Peter Chou, Taipei, TW;
Lucy Tian, Tianjin, CN;
Ivan Fu, Tianjin, CN;
Samuel Li, Tianjin, CN;
May-Luen Chou, Taipei, TW;
Vishay General Semiconductor LLC, Hauppauge, NY (US);
Abstract
An integrated circuit device includes a die, a lead, and an electrically-conductive structure that is arranged to facilitate electrical communication between the die and the lead. The device also includes a potting material, in which the electrically conductive structure, the die, and at least part of the lead are embedded. An electrically-conductive housing encases the potting material and forms exterior packaging of the device. During manufacturing, the electrically-conductive structure, the die, and at least part of the lead may be arranged within the electrically-conductive housing either before or after the potting material is disposed in the housing. When the integrated circuit device is operating, heat is removable from the die via a thermal conduction path formed by the electrically-conductive structure, the potting material, and the electrically-conductive housing.