Scottsdale, AZ, United States of America

Samuel L Coffman


Average Co-Inventor Count = 2.5

ph-index = 6

Forward Citations = 633(Granted Patents)


Company Filing History:


Years Active: 1987-2011

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6 patents (USPTO):Explore Patents

Title: Innovator in Semiconductor Technology: Samuel L. Coffman

Introduction: Samuel L. Coffman is an accomplished inventor based in Scottsdale, AZ, with a notable portfolio of six patents primarily focused on advancements in semiconductor technology. His innovations have contributed significantly to the field, enabling more efficient and effective semiconductor packaging methods.

Latest Patents: Among Samuel's recent patents, two standout innovations include a novel semiconductor package and an innovative process for manufacturing and packaging semiconductor devices. The first patent describes a semiconductor package substrate featuring an array of identical package sites, fully covered by an encapsulant. This design allows for singulation of the individual package sites by sawing through the encapsulant and the substrate. The second patent outlines a comprehensive process for manufacturing semiconductor devices that involves selective plating and etching. It includes techniques for forming die attach areas and contact areas on a conductive sheet, ultimately resulting in a molded resin housing that encapsulates the semiconductor device die.

Career Highlights: Samuel has an impressive career history, having worked with renowned companies such as Motorola Corporation and Freescale Semiconductor. His work at these organizations has bolstered his reputation as an innovative leader in semiconductor technology, allowing him to develop patents that address practical challenges in the industry.

Collaborations: Throughout his career, Samuel has collaborated with notable professionals, including Son Ky Quan and Bruce Reid. These partnerships have fostered an environment of creativity and innovation, leading to the successful development of his patented technologies.

Conclusion: Samuel L. Coffman's contributions to semiconductor technology demonstrate his exceptional inventiveness and commitment to advancing the industry. His six patents reflect a deep understanding of the technical challenges in semiconductor device manufacturing and packaging, positioning him as a key figure in the field. As technology continues to evolve, Samuel's innovations will undoubtedly play a significant role in shaping the future of semiconductor applications.

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