The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2002

Filed:

Feb. 01, 2000
Applicant:
Inventors:

Jenn-Hwa Huang, Gilbert, AZ (US);

Samuel L. Coffman, Scottsdale, AZ (US);

Xi-Qing Sun, Chandler, AZ (US);

Ji-Hai Xu, Gilbert, AZ (US);

John Michael Parsey, Jr., Phoenix, AZ (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01H 5/700 ;
U.S. Cl.
CPC ...
H01H 5/700 ;
Abstract

A Micro-Electromechanical Systems (MEMS) device ( ) having conductively filled vias ( ). A MEMS component ( ) is formed on a substrate ( ). The substrate has conductively filled vias ( ) extending therethrough. The MEMS component ( ) is electrically coupled to the conductively filled vias ( ). The MEMS component ( ) is covered by a protective cap ( ). An electrical interconnect ( ) is formed on a bottom surface of the substrate ( ) for transmission of electrical signals to the MEMS component ( ), rather than using wirebonds.


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