Company Filing History:
Years Active: 2023-2025
Title: Innovations by Sam Vaziri in Semiconductor Technology
Introduction
Sam Vaziri is an accomplished inventor based in San Jose, California. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his innovative approach to packaging semiconductor devices.
Latest Patents
Vaziri's latest patents include a semiconductor package featuring an encapsulant comprising conductive fillers and a method of manufacture. This invention discloses packaged semiconductor devices that utilize high-thermal conductivity molding compounds. In one embodiment, the semiconductor device consists of a first redistribution structure, a first die that is electrically coupled to this structure, and a first through via that is also electrically connected. An insulation layer extends along the first redistribution structure, the first die, and the first through via. The encapsulant, which surrounds portions of the first through via and the first die, includes conductive fillers at a concentration ranging from 70% to about 95% by volume.
Career Highlights
Sam Vaziri is currently employed at Taiwan Semiconductor Manufacturing Company Limited, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing advanced packaging solutions that enhance the performance and reliability of semiconductor devices.
Collaborations
Some of his notable coworkers include Xinyu Bao and Lee-Chung Lu, who collaborate with him on various projects within the semiconductor field.
Conclusion
Sam Vaziri's contributions to semiconductor technology through his innovative patents and work at Taiwan Semiconductor Manufacturing Company Limited highlight his role as a leading inventor in the industry. His advancements in semiconductor packaging are paving the way for future innovations.