Taiwan Semiconductor Manufacturing Comp. Ltd.

Sam Vaziri

Lee-Chung Lu

Po-Hsiang Huang

Fong-yuan Chang

Xinyu Bao

Jyh Chwen Frank Lee

Packaged semiconductor devices including high-thermal conductivity molding compounds and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first redistribution structure; a first die over and electrically coupled to the first redistribution structure; a first through via over and electrically coupled to the first redistribution structure; an insulation layer extending along the first redistribution structure, the first die, and the first through via; and an encapsulant over the insulation layer, the encapsulant surrounding portions of the first through via and the first die, the encapsulant including conductive fillers at a concentration ranging from 70% to about 95% by volume.

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San Jose, CA, United States of America

Sam Vaziri